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From: FUBHO1/12/2010 3:00:12 PM
   of 7146
 
GlobalFoundries readies tool orders, swallows Chartered

Mark LaPedus
(01/12/2010 11:37 AM EST)
URL: eetimes.com

HALF MOON BAY, Calif. -- Having recently completed the acquisition of Singapore's Chartered Semiconductor Manufacturing Pte. Ltd., GlobalFoundries Inc. this week is expected to launch the new, combined entity.
As expected, the combined foundry entity will be called GlobalFoundries. The foundry upstart will also shortly begin to evaluate equipment vendors for its new 300-mm fab in upstate New York, said Norm Armour, vice president and general manager for Fab 2 at GlobalFoundries (Sunnyvale, Calif.).

This quarter, the company is ''kicking off selection teams'' that will procure tools for the fab, Armour said at SEMI's Industry Strategy Symposium (ISS) here. In the third quarter, GlobalFoundries will select the tools for the U.S. fab., he told EE Times.

No tool decisions have been officially made, he said, although it is widely believed that the company will use 193-nm scanners from its main lithography vendor: ASML Holding NV of the Netherlands. GlobalFoundries is also moving towards a dual-vendor strategy in lithography, propelling Nikon Corp. of Japan into the mix. Applied, KLA-Tencor, Novellus, TEL and others are expected to gain orders at GlobalFoundries.

Recently, GlobalFoundries began construction of the new, 300-mm fab in 2009, with plans to eventually process 32-nm devices and beyond. The $4.2 billion manufacturing facility, to be completed in 2012, is located at the Luther Forest Technology Campus in Saratoga County, N.Y. In total, GlobalFoundries will spend $6 billion in capital expenditures.

In 2008, the new silicon foundry spinoff from Advanced Micro Devices Inc. (AMD) opened for business, disclosed its corporate name and unveiled its strategy.

GlobalFoundries is a joint venture between AMD and the Advanced Technology Investment Co. (ATIC) of Abu Dhabi. Under the current plan, AMD owns a 34.2 percent stake of the foundry venture, while ATIC will own the remaining shares.

Also in 2008, the foundry spinoff became the latest member in IBM's ''fab club,'' which also includes Chartered, IBM and Samsung. The spinoff will gain access to IBM's common platform technology, including its 32/38-nm technology. The 32-nm process, which has yet to ship, includes high-k and metal gates.

Late last year, ATIC acquired Chartered for a total of $3.9 billion. Chartered will be folded into GlobalFoundries.

This week, the two companies will officially announce the combined entity, to be named GlobalFoundries. The Chartered name will be dropped. As reported, Doug Grose, chief executive of GlobalFoundries, will remain CEO of the combined company, which will have 10,000 employees.

The combined entity will have fabs in Germany, Singapore, and eventually, upstate New York. Last month, Chartered began the next phase of an expansion plan within its 300-mm fab in Singapore. The silicon foundry provider plans to nearly double its production level in Fab 7, from 30,000 wafers a month to 50,000 wafers a month.

Under GlobalFoundries, Chartered will mostly make 65-nm devices within Fab 7, Armour said. It's possible that Chartered will also make 45-/40-nm devices, but GlobalFoundries will focus on the leading-edge, he said.

The main fab for GlobalFoundries is Fab 36 in Dresden, Germany. Previously owned by AMD, that 300-mm fab is currently making 45-nm processors for AMD. GlobalFoundries is also proceeding with plans to expand its Dresden-based manufacturing lines, by bringing a second 300-mm manufacturing facility with bulk silicon capabilities.

The Dresden cluster, re-named Fab 1, has two modules. Module 1 will initially focus on the production of high-performance, 45-nm silicon-on-insulator (SOI) technology, mostly processors for AMD. Module 2 will be the soon-to-be completed 32-nm (and beyond) bulk silicon facility.

Module 2 will also have a 40-nm low-power, non-SOI process due out this year. Within the German fab, the company plans to take a dual-vendor strategy, mainly in lithography, Armour said.

In Germany, GlobalFoundries has been using ASML's 193-nm scanners for the critical layers, Armour said. Going forward, GlobalFoundries will also use Nikon's scanners as well, he said.

GlobalFoundries is also moving to integrate the fabs from the company and Chartered. The two companies use the same MES system, but the ERP systems are different. Other integration challenges remain, namely how to combine the two operations without upsetting internal employees and customers.

Qualcomm Inc. recently expanded its foundry roster, by announcing a deal with GlobalFoundries. Initially, GlobalFoundries said it intends to provide Qualcomm (San Diego) with access to 45-nm low-power and 28-nm foundry technologies, with an intended collaboration on future advanced process nodes.

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From: FUBHO1/13/2010 12:02:20 PM
   of 7146
 
Samsung urges for more EUV support

Mark LaPedus
(01/13/2010 9:56 AM EST)
URL: eetimes.com

HALF MOON BAY, Calif. -- South Korea's Samsung Electronics Co. Ltd. has publicly jumped on the extreme ultraviolet (EUV) lithography bandwagon.
Samsung has also joined the chorus that the industry must do more to enable EUV, which has been beset by delays.

Behind the scenes, Samsung has been working on EUV for chip production and could put the technology in R&D as early as this year. The company is also said to have ordered one of the ''pre-production'' EUV tools from ASML Holding NV of the Netherlands.

With a working, high numerical aperture system, EUV could propel Moore's Law and pave the way for 5-nm designs, said Kinam Kim, a Samsung fellow and president of Samsung Advanced Institute of Technology, an R&D unit of the Korean conglomerate.

''I am 100 percent confident we will make EUV available,'' he said at SEMI's Industry Strategy Symposium (ISS) here.

He also acknowledged that EUV must overcome some technical hurdles, such as the power source and mask infrastructure. "We require more aggressive participation'' from the tool vendors and IC industry, he added.

Following warning shots from Intel Corp., Sematech recently sounded the alarm bells--again. The chip-making consortium recently warned that there is still a major funding shortfall and a lack of mask inspection gear to enable EUV lithography.

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From: FUBHO1/13/2010 5:06:22 PM
   of 7146
 
TSMC denies buying Nikon's wet tool--for now

Mark LaPedus
(01/12/2010 4:10 PM EST)
URL: eetimes.com

HALF MOON BAY, Calif. -- Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) denies that it has procured a new 193-nm immersion lithography scanner from Nikon Corp.--for now.
For years, TSMC has primarily used only one lithography vendor: ASML Holding NV. But TSMC reportedly bought a new 193-nm immersion lithography scanner from rival Nikon of Japan, according to sources.

According to a filing with the Taiwan stock exchange, TSMC disclosed that it has made a NT$1,087,947,900 ($34.1 million) transaction with Nikon, but the documents did not elaborate on the details.

''We didn't buy immersion from Nikon according the filing. We still buy from ASML,'' said Dennic Hu of the Production Equipment Procurement Division at TSMC, in an e-mail. ''Nikon is our partner in providing us dry scanners.''

Hu did not elaborate, but TSMC is seriously evaluating Nikon's immersion scanners. Related to the recent filing, TSMC recently procured multiple S210 tools from Nikon, sources said. The S210 is Nikon's latest 248-nm systems, sources said.

Nikon may ''get an S620 order from TSMC, but not until later in 2010,'' one source said. The S620 is Nikon's latest 193-nm immersion scanner.

TSMC, according to the source, has ''not ordered an S620. They are interested in the S620, but I don't think they will make a buy decision for three months. They are running demos and collecting information. So, that will take time.''

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To: Cary Salsberg who wrote (1698)1/16/2010 2:59:45 AM
From: niek
   of 7146
 
Intel is using an EUV beta tool from ASML already:

asml.com

I'm almost certain that ASML will deliver one or more EUV production tools at Intel. ASML is recruiting hundreds of new engineers for the production proces.

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To: niek who wrote (1704)1/16/2010 6:15:03 PM
From: Cary Salsberg
   of 7146
 
Thank you. I was being facetious.

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To: Cary Salsberg who wrote (1705)1/20/2010 4:48:20 AM
From: niek
   of 7146
 
ASML Announces 2009 Fourth Quarter and Full Year Results; Rise in Bookings Confirms Strong 2010 First Half Year

VELDHOVEN, the Netherlands, January 20, 2010 - ASML Holding NV (ASML) today announces 2009 fourth quarter and full year results according to US GAAP as follows:

* Q4 2009 net sales of EUR 581 million versus Q3 2009 net sales of EUR 555 million (Q4 2008 net sales of EUR 494 million). Full year 2009 net sales were EUR 1,596 million, down 46.0 percent versus 2008 net sales of EUR 2,954 million.
* Q4 2009 net income of EUR 50 million, or 8.7 percent of net sales, versus Q3 2009 net income of EUR 20 million, or 3.6 percent of net sales (Q4 2008 net loss of EUR 88 million or 17.8 percent of net sales). Full year 2009 net loss amounted to EUR 151 million or 9.5 percent of net sales, compared with 2008 net income of EUR 322 million or 10.9 percent of net sales.
* Q4 2009 net bookings valued at EUR 956 million with 40 systems including 35 new and 5 used systems, leading to an order backlog valued at EUR 1,853 million as of December 31, 2009.

"We closed the year as planned with improved sales and strong bookings, as the semiconductor business recovers, driven by technology buys from the memory market segments and technology and capacity buys from major Foundry customers," said Eric Meurice, president and Chief Executive Officer of ASML. "Thanks to our continued heavy investments in Research & Development we have been able to ramp up our new mid-range and top-of-the-range platforms, respectively the XT:1950Hi and the NXT:1950i scanners. In parallel, we are making good progress with our next generation EUV technology, as system integration and source performance development confirms shipments of the first pre-production systems in the second half of 2010. We thus closed off a challenging year, having generated cash from operations, set up a more efficient cost structure and built an even stronger product portfolio," Meurice said.

Operations Update

Full year 2009 net sales of EUR 1,596 million consisted of system sales of EUR 1,175 million, as the company shipped a total of 70 systems, including 47 new and 23 used, and net service and field option sales which amounted to EUR 421 million. 2008 net sales of EUR 2,954 million consisted of net system sales of EUR 2,517 million, as the company shipped a total of 151 systems, including 115 new and 36 used, and net service and field option sales of EUR 437 million.

In Q4 2009, ASML's net sales of EUR 581 million included 19 new and 6 used systems, totaling net system sales of EUR 432 million, and net service and field option sales of EUR 149 million. Net system sales for Q3 2009 included the shipment of 17 new and 7 used machines, totaling EUR 459 million, and net service and field option sales of EUR 96 million.

The Q4 2009 average selling price for a new system was EUR 19.7 million, reflecting a mix of immersion scanners aimed at technology upgrades and a number of complementary dry systems for less critical layers, compared with the Q3 2009 average selling price for a new system of EUR 23.4 million. The Q4 2009 average selling price for all ASML systems sold was EUR 17.3 million, compared with the Q3 2009 average selling price for all ASML systems sold of EUR 19.1 million.

Q4 2009 net bookings totaled 40 systems valued at EUR 956 million.

ASML's order backlog as of December 31, 2009 was EUR 1,853 million, totaling 69 systems with an average selling price of EUR 26.8 million. ASML's backlog as of September 27, 2009 was valued at EUR 1,353 million, totaling 54 systems with an average selling price of EUR 25.1 million.

In Q4 2009, ASML generated a net income of EUR 50 million, or EUR 0.12 net income per ordinary share as compared with a net income in Q3 2009 of EUR 20 million or EUR 0.05 net income per ordinary share. We recorded a net loss of EUR 151 million (EUR 0.35 net loss per ordinary share) for the 2009 full year, compared with a net income of EUR 322 million (EUR 0.75 net income per ordinary share) for 2008.

The company's Q4 2009 gross margin was 38.0 percent. This margin is the result of an improvement of the company's cost structure and stronger service and field option sales and compares with the Q3 2009 gross margin of 34.4 percent.

Q4 2009 research and development (R&D) costs were EUR 115 million including credits versus Q3 2009 R&D costs of EUR 115 million including credits.

Selling, general and administrative (SG&A) costs were EUR 37 million in Q4 2009, compared with SG&A costs of EUR 38 million in Q3 2009.

Net cash generated was EUR 19 million in Q4 2009. ASML ended Q4 2009 with EUR 1,037 million in cash and cash equivalents, compared with EUR 1,018 million by the end of Q3 2009.

Outlook

"We booked EUR 956 million of systems in the fourth quarter of 2009 and expect bookings of the same order of magnitude for the first quarter of 2010, confirming an upturn of the semiconductor industry," Eric Meurice said. "Of our backlog, 49 units are for new immersion systems, including 17 advanced NXT:1950i scanners. The immersion bookings continue to be led by technology upgrades required to manufacture our customers' richer mix of new semiconductor designs: mainly 40 nanometer (nm) DRAM memory chips and Logic integrated circuits, but also 20s and 30s nm NAND Flash memory products. Shipments will continue to grow, with the first quarter somewhat restricted, due to standard - long - equipment industry production lead times and new product introduction challenges, followed by a much higher second quarter," Meurice added.

ASML expects net sales of around EUR 700 million in Q1 2010 and of around EUR 950 million in Q2 2010. We expect gross margin in Q1 2010 of about 40 percent. R&D expenditures are expected to be at EUR 120 million and SG&A costs are expected at EUR 40 million.

ASML will submit a proposal to the 2010 General Meeting of Shareholders to declare an unchanged dividend paid in respect of 2009 of EUR 0.20 per ordinary share (approximately EUR 87 million) (EUR 0.20 per ordinary share paid in respect of 2008).

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To: niek who wrote (1706)1/20/2010 7:52:48 AM
From: dr_elis
   of 7146
 
Very good numbers indeed. I wonder, I´m now up about 65% up on my last purchase of ASML - time to sell? Or sell in "May and go away" again this year?

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From: FUBHO2/17/2010 2:28:02 AM
   of 7146
 
Analyst: Samsung hogging litho supply chain


Mark LaPedus
(02/09/2010 4:28 PM EST)
URL: eetimes.com

SAN JOSE, Calif. -- South Korea's Samsung Electronics Co. Ltd. could boost its capital spending amid the IC recovery.
In the process, Samsung is also procuring a slew of 193-nm scanners from ASML Holding NV of the Netherlands. In fact, the chip maker is hogging the supply chain for ASML systems.

That's good news for Samsung, but bad news for its memory rivals that use ASML's tools, such as Elpida, Hynix, IM Flash, Micron, Nanya and others. NAND rival Toshiba Corp. is said to use scanners from Nikon Corp.

But there are also implications for Chartered/GlobalFoundries, TSMC and UMC, which also rely on ASML tools.

''Samsung is locking up equipment loading slots (particularly for immersion), delaying equipment deliveries to other players. The broad implication here is that lead times for immersion tools will likely continue to extend, putting pressure on tier-two DRAM players,'' said C.J. Muse, an analyst with Barclays Capital, in a report.

''Clearly, a part of Samsung's plan is to get a first mover advantage by locking up loading slots -- particularly for immersion. All along we have modeled Samsung getting shipped 25 immersion tools in 2010, including 24 from ASML and 1 from Nikon. We understand more than 65 percent of these tools have been ordered with shipment delivery expected in 1H10,'' Muse said.

Samsung is procuring ASML's new 193-nm immersion tool, dubbed the NXT. ''Our view continues to be that Samsung has been aggressively locking up ASML NXT slots and that they will come back in 2Q10 and place more orders (particularly for the NXT),'' Muse said.

''The broad implication here is that lead times for immersion tools will likely continue to extend, putting pressure, in particular, on tier-two DRAM players. It is here where we expect more meaningful immersion orders over the coming quarters (we understand Elpida and Hynix are placing orders in 1Q10) and that this should provide increased visibility to other front-end equipment companies for their shipments through the remainder of 2010,'' he said.

The losers in the litho world? ''Our checks suggest that a two- to three-month slip has slowly materialized for Nanya/Inotera and Rexchip's litho tool schedule,'' he said, referring to the Taiwan DRAM makers.

Taiwan's Inotera has a DRAM joint partnership with Micron Technology Inc. Taiwan's Rexchip is a DRAM venture between Japan's Elpida and Powerchip Semiconductor Corp.

''We think that Samsung is not oblivious to the fact that given ASML has a finite capacity, its capacity to consume NXT litho tools for its build-out has very real consequences to the profitability of DRAM players which are not yet at 50-nm or sub-50-nm nodes,'' he said.

''In NAND, the picture is slighly complex, where IM Flash has captured the lead in the race to the 2X-nm node, with Samsung and Toshiba right behind and with Hynix in the rear, just managing to enter the 3X-nm node,'' he said.

''However, Samsung and Micron both play in the DRAM as well as NAND market, and therefore a delay of Nanya/ Inotera conversion means that DRAM manufacture cannot be offloaded to Nanya/ Inotera and Micron's Manassas, Virginia and Lehi, Utah fabs' capacity cannot be fully dedicated to NAND,'' he said. ''This also, in a sense delays additionally capacity being built in IMF-Singapore.''

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From: FUBHO2/22/2010 6:43:15 AM
   of 7146
 
TSMC to take delivery of ASML EUV lithography system
Press release, February 22; Rodney Chan, DIGITIMES [Monday 22 February 2010]

digitimes.com

ASML Holding today announced that Taiwan Semiconductor Manufacturing Company (TSMC) will take delivery of a Twinscan NXE:3100 extreme ultra-violet (EUV) lithography system. This tool represents one of six NXE:3100 EUV systems for ASML's worldwide partners and customers...

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To: FUBHO who wrote (1709)2/22/2010 7:07:30 AM
From: cluka
   of 7146
 
Bob G,

Do we know if this is CYMI EUV source?

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